FPT Plans Memory Chip Packaging and Testing Plant in Hanoi

FPT and Japan’s SBI Holdings signed a memorandum of understanding to explore a potential investment by SBI Holdings in a memory chip packaging and testing plant in Hanoi. The two companies will discuss an investment cooperation plan, with SBI Holdings considering participation as a strategic investor. Specific terms have yet to be agreed.

The signing ceremony took place in Tokyo during an official visit to Japan by Tô Lâm, General Secretary of the Communist Party of Vietnam and President of Vietnam. During the visit, he met and held talks with senior leaders of the Japan Business Federation.

Under the disclosed plan, FPT intends to establish a joint venture with two South Korean semiconductor companies through its subsidiary Công ty TNHH FPT IS. The joint venture would build and operate the Hanoi plant. The cooperation plan is still under discussion, and the report did not disclose the investment amount or a start date for operations.

Semiconductor packaging and testing follow wafer fabrication. Packaging protects chips and connects them to device circuit boards, while testing screens for defects and checks functionality and durability. FPT hopes the Hanoi project will help it develop memory chip packaging and testing capabilities and train engineers and technicians in the field.

Inside FPT’s semiconductor packaging and testing plant in Bắc Ninh.（VietVance）

Source: VietVance